Apparatus methods for controlling wafer temperature in...

Details Apparatus methods for controlling wafer temperature in... Apparatus methods for controlling wafer temperature in...

2006-01-10

2006-01-10

Nguyen, George (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S007000, C451S053000, C451S060000, C451S288000

Reexamination Certificate

active

06984162

ABSTRACT:
Apparatus controls the temperature of a wafer for chemical mechanical polishing operations. A wafer carrier wafer mounting surface positions a wafer adjacent to a thermal energy transfer unit for transferring energy relative to the wafer. A thermal energy detector oriented adjacent to the wafer mounting surface detects the temperature of the wafer. A controller is responsive to the detector for controlling the supply of thermal energy relative to the thermal energy transfer unit. Embodiments include defining separate areas of the wafer, providing separate sections of the thermal energy transfer unit for each separate area, and separately detecting the temperature of each separate area to separately control the supply of thermal energy relative to the thermal energy transfer unit associated with the separate area.

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