Capacitor for semiconductor device, manufacturing method...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S239000, C438S650000, C438S686000

Reexamination Certificate

active

07105401

ABSTRACT:
A capacitor for use in a semiconductor device, a method of fabricating the capacitor, and an electronic device adopting the capacitor, wherein the capacitor includes upper and lower electrodes, each formed of a platinum group metal; a thin dielectric layer disposed between the upper and lower electrodes; and a buffer layer disposed between the lower electrode and the thin dielectric layer, the buffer layer including a metal oxide of Group 3, 4, or 13. In an embodiment, the method of fabricating includes absorbing CO on a surface of a lower electrode of a platinum group metal, placing the lower electrode under a reducing atmosphere to produce a lattice oxygen, using the lattice oxygen to form a thin dielectric layer by performing an ALD process using a precursor for the thin dielectric layer, and forming an upper electrode of a platinum group metal on the thin dielectric layer.

REFERENCES:
patent: 6144069 (2000-11-01), Tung
patent: 6162293 (2000-12-01), Kijima et al.
patent: 2002/0001858 (2002-01-01), Kim et al.
patent: 2002/0074584 (2002-06-01), Yang
patent: 0 540 994 (1993-05-01), None
patent: 1999-0080412 (1999-11-01), None
patent: 2002-0013189 (2002-02-01), None
Patent Abstracts of Japan, vol. 0182, No. 13 (E-1538), Apr. 15, 1994 & JP 6-013542 (Pub. Date:Jan. 21, 1994).
*Entitled: “Engineered Tantalum Aluminate and Hafnium Aluminate and Films for Ultrathin . . . ”.
**Entitled: “High-kappa Gate Dielectrics: Current Status and Materials Properties Considerations”.
***Entitled: “Common and Unique Aspects of Perovskite Thin Film CVD Processes”.

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