Chip carrier for semiconductor chip

Details Chip carrier for semiconductor chip Chip carrier for semiconductor chip

2006-09-05

2006-09-05

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S678000, C257S734000

Reexamination Certificate

active

07102239

ABSTRACT:
A chip carrier for a semiconductor chip is provided. A plurality of solder pads for bump soldering are formed on a chip mounting surface of the chip carrier, to allow a flip chip to be mounted and electrically connected to the chip carrier. A solder mask layer is formed on the chip carrier, wherein a plurality of openings are provided in the solder mask layer to expose the solder pads, and an outwardly opening extended portion is formed respectively from the openings corresponding to the solder pads having a relatively narrower pitch therebetween, so as to prevent formation of voids during an underfill process for filing a gap between the flip chip and the chip carrier.

REFERENCES:
patent: 5710063 (1998-01-01), Forehand et al.
patent: 6750084 (2004-06-01), Delheimer
patent: 6774497 (2004-08-01), Qi et al.
patent: 6787918 (2004-09-01), Tsai et al.

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