Method and apparatus for substrate polishing

Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – Defined electrolyte movement or pressure

Reexamination Certificate

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C204S22400M, C204S282000

Reexamination Certificate

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06977036

ABSTRACT:
A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.

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