Method of forming a memory device and semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S211000, C438S778000

Reexamination Certificate

active

06924186

ABSTRACT:
A novel technique to quench electrical defects in CVD Al2O3layers is disclosed. A small amount of silicon dopant to the aluminum oxide film reduces the leakage current as well as the gap interface trap density at the dielectric/silicon interface. The implanted silicon gives a better interface and improves the leakage characteristics of the dielectric.

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S. Wolf and R.N. Tauber, “Ion Implantation for VLSI,”Silicon Processing for the VLSI Era, vol. 1—Process Technology, Chapter 9, pp. 280-327 (1986).
S. Wolf and R.N. Tauber, “Suprem III Models: Ion Implantation,”Silicon Processing for the VLSI Era, vol. II, Chapter 9.2.2, pp. 658-661 (1986).

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