Semiconductor device and method of manufacturing the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S386000, C438S700000, C257S302000

Reexamination Certificate

active

06964899

ABSTRACT:
Disclosed is a semiconductor device having a bit line extending in a first direction, a plurality of transistors electrically connected to the bit line, a plurality of first electrodes arranged in the first direction and electrically connected to the transistors, a dielectric film covering upper and side surfaces of the first electrodes, and a second electrode covering the dielectric film, wherein a width of the first electrode is smaller than a distance between adjacent first electrodes and smaller than the minimum value of design rule of the semiconductor device.

REFERENCES:
patent: 5392232 (1995-02-01), Kim et al.
patent: 6642564 (2003-11-01), Ogawa et al.
patent: 4-336464 (1992-11-01), None
patent: 6-21340 (1994-01-01), None
patent: 9-283719 (1997-10-01), None
patent: 2000-31434 (2000-01-01), None
patent: 2001-189434 (2001-07-01), None
patent: 2003-23107 (2003-01-01), None
Notification of Reasons for Rejection (Office Action) for Japanese Patent Application No. 2003-103043, mailed May 10, 2005 and English translation thereof.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3500307

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.