Semiconductor process for disposable sidewall spacers

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S304000, C438S306000

Reexamination Certificate

active

06849515

ABSTRACT:
A semiconductor process and structure (32) uses a disposable sidewall spacer (42) associated with lightly doped drain (LDD) transistors. The disposable sidewall spacers are efficiently removed by a gaseous fluorine ambient. Either molecular or atomic fluorine gas is used to remove a silicon germanium sidewall spacer with high selectivity to exposed insulating layers. This etch process is also isotropic. An additional benefit of using a gaseous fluorine ambient is incorporation of fluorine in isolation regions (48) surrounding the transistors, thereby reducing the dielectric constant. Improved insulating properties of the isolations regions can allow increased integration.

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Wolf, Stanley Wolf Ph.D. and Richard N. Tauber Ph.D. in Silicon Processing for the VLSI Era, vol. 1: Process Technology, Lattice Press, 1986, pp. 546-551.*
Ranade, Pushkar et al.; “Application of Silicon-Germanium in the Fabrication of Ultra-shallow Extension Junctions for Sub-100 nm PMOSFETs”; IEEE Transactions on Electron Devices; Aug. 2002'; pp 1436-1443; vol. 49, No. 8; IEEE.
Parrillo, Louis C. et al.; “An Advanced 0.5μm CMOS Disposable LDD Spacer Technology”; Motorola, Advanced Products Research and Development Laboratory; Austin, TX.
U.S. Appl. No. 10/339,062, filed Jan. 2, 2003.
U.S. Appl. No. 10/631,283, filed Jul. 31, 2003.

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