Fabrication of microstructures with vacuum-sealed cavity

Details Fabrication of microstructures with vacuum-sealed cavity Fabrication of microstructures with vacuum-sealed cavity

2005-06-07

2005-06-07

McDonald, Rodney G. (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S192170, C438S026000, C438S051000, C438S052000, C438S053000, C438S106000, C438S124000, C438S127000, C438S694000, C438S700000, C438S702000, C438S703000

Reexamination Certificate

active

06902656

ABSTRACT:
A cavity forming formed in an encapsulation structure under a vacuum in a vacuum chamber is sealed with a capping layer. A stiff protective layer under tensile stress is deposited on the capping layer prior to venting the vacuum chamber to atmospheric pressure. The capping layer is preferably aluminum or an aluminum alloy, and the protective layer is preferably δ-TiN having a suitable high Young's modulus.

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