Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making named article
Reexamination Certificate
2005-03-01
2005-03-01
McPherson, John A. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making named article
C438S070000
Reexamination Certificate
active
06861207
ABSTRACT:
A method of fabricating microlens devices. The method includes filling the bond pad areas and scribe lines, or other areas, to improve the topography of the semiconductor wafer surface. A microlens material is applied to the surface after the bond pad areas and scribe lines have been filled. Because of the improved topography, the thickness of the microlens material is more uniform, thereby facilitating the formation of uniformly shaped microlenses.
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patent: 2001-0010306 (2004-02-01), None
English language translation of KR 2001-0010306, Feb. 2001.*
English abstract of KR 2001-010306, Feb. 5, 2001, Kim, with figure.
Chang Chih-Kung
Chang Chiung-Yuan
Hsu Hung-Jen
Kuo Chin-Chen
Tseng Te-Fu
McPherson John A.
Slater & Matsil L.L.P.
Taiwan Semiconductor Manufacturing Company , Ltd.
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