Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate
2005-04-19
2005-04-19
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Test or calibration structure
C257S774000, C324S437000, C324S757020, C324S758010
Reexamination Certificate
active
06881974
ABSTRACT:
Various aspects of the invention provide methods of manufacturing probe cards and test systems which may test microelectronic components using such probe cards. In one specific example, a probe card may be manufactured by forming a plurality of blind holes in a substrate, with each hole having a closed bottom spaced from a back of the substrate by a back thickness. An electrically conductive metal may be deposited on the substrate to fill the holes and define an overburden on the substrate. The metal in each hole may define a conductor. At least a portion of the overburden may be removed to electrically isolate each of the conductors from one another. A portion of the substrate including the back thickness is removed to define an array of pins extending outwardly from a remaining thickness of the substrate, with each pin being an exposed length of one of the conductors.
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Doan Trung T.
Hembree David R.
Wood Alan G.
Chambliss Alonzo
Micro)n Technology, Inc.
Perkins Coie LLP
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