Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-09-27
2005-09-27
Zarabian, Amir (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S778000, C438S612000, C438S620000, C257S759000, C257S774000
Reexamination Certificate
active
06949458
ABSTRACT:
A method and structure for forming a sidewall image transfer conductor having a contact pad includes forming an insulator to include a recess, depositing a conductor around the insulator, and etching the conductor to form the sidewall image transfer conductor, wherein the conductor remains in the recess and forms the contact pad and the recess is perpendicular to the sidewall image transfer conductor.
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Conrad Edward W.
Lam Chung H.
Martin Dale W.
Sprogis Edmund
McGinn & Gibb PLLC
Sabo, Esq. William D.
Tran Thanh Y.
Zarabian Amir
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