4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. For plural devices

Edmund Sprogis

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Dual-sided chip attached modules

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Dual-sided chip attached modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Metal wiring structures for uniform current density in C4 balls

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
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Multi-chip module utilizing a nonconductive material...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Self-aligned contact areas for sidewall image transfer...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2329960

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