Module assembly for stacked BGA packages

Details Module assembly for stacked BGA packages Module assembly for stacked BGA packages

2005-01-04

2005-01-04

Abraham, Fetsum (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000, C257S787000, C257S783000, C257S782000, C257S784000, C257S698000

Reexamination Certificate

active

06838768

ABSTRACT:
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.

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