4. Plastic article or earthenware shaping or treating: apparatus
  5. Distinct means to feed, support or manipulate preform stock...
  6. Female mold type means

Leonard E. Mess

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Alignment and orientation features for a semiconductor package

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Alignment and orientation features for a semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
Reexamination Certificate

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Alignment and orientation features for a semiconductor package

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Apparatus and methods of packaging and testing die

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Apparatus and methods of packaging and testing die

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1153356

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