Solder bump transfer sheet, method for producing the same,...

Details Solder bump transfer sheet, method for producing the same,... Solder bump transfer sheet, method for producing the same,...

2005-09-13

2005-09-13

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S615000, C438S616000

Reexamination Certificate

active

06943102

ABSTRACT:
The method for producing a solder bump transfer sheet of the invention includes the steps of: providing a sheet having a chromium oxide layer containing substantially no iron oxide as the outermost surface; and forming a plurality of solder bumps placed in a predetermined pattern on the chromium oxide layer.

REFERENCES:
patent: 5667849 (1997-09-01), Carey, II et al.
patent: 5825629 (1998-10-01), Hoebener et al.
patent: 6432807 (2002-08-01), Tsukui et al.
patent: 6451130 (2002-09-01), Chung et al.
patent: 03-145135 (1991-06-01), None
patent: 04-335532 (1992-11-01), None
patent: 05-129363 (1993-05-01), None
patent: 05-138396 (1993-06-01), None
patent: 05-190602 (1993-07-01), None
patent: 06-084922 (1994-03-01), None
patent: 07-066545 (1995-03-01), None
patent: 07-169767 (1995-07-01), None
patent: 09-217166 (1997-08-01), None
patent: 10-098257 (1998-04-01), None
patent: 10-135223 (1998-05-01), None
patent: 11-312758 (1999-11-01), None

Affiliated with

Also associated with

Rating

Solder bump transfer sheet, method for producing the same,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder bump transfer sheet, method for producing the same,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder bump transfer sheet, method for producing the same,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3409279