Silicon-on-insulator wafer and method of manufacturing the same

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S459000, C438S519000

Reexamination Certificate

active

06884693

ABSTRACT:
In a silicon-on-insulator (SOI) wafer and a method of manufacturing the same, the SOI wafer includes a first semiconductor wafer including an isolation insulating film formed to define an active region; a well region and a buried layer formed in the active region of the first semiconductor wafer; and a second semiconductor wafer bonded with the first semiconductor wafer, wherein an SOI insulating film, which contacts a lower portion of the isolation insulating film and electrically insulates a lower portion of the active region, is formed.

REFERENCES:
patent: 5496764 (1996-03-01), Sun
patent: 5789788 (1998-08-01), Ema et al.
patent: 6051480 (2000-04-01), Moore et al.
patent: 6242320 (2001-06-01), So
patent: 4-3910 (1992-01-01), None
patent: 7-231036 (1995-08-01), None
patent: 10-223497 (1998-08-01), None
patent: 00-183157 (2000-06-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Silicon-on-insulator wafer and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Silicon-on-insulator wafer and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Silicon-on-insulator wafer and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3408853

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.