Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-09-20
2005-09-20
Everhart, Caridad (Department: 2825)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S540000, C438S132000
Reexamination Certificate
active
06946379
ABSTRACT:
A semiconductor device having at least one fuse and an alignment mark formed therein. An etch resistant layer over the surface of the fuse and alignment mark, which provides a uniform passivation thickness for use in conjunction with laser fuse deletion processes.
REFERENCES:
patent: 4198744 (1980-04-01), Nicolay
patent: 4536949 (1985-08-01), Takayama et al.
patent: 5273920 (1993-12-01), Kwasnick et al.
patent: 5447887 (1995-09-01), Filipiak et al.
patent: 5659201 (1997-08-01), Wollesen
patent: 5731624 (1998-03-01), Motsiff et al.
patent: 5760453 (1998-06-01), Chen
patent: 5955773 (1999-09-01), Stamper
patent: 6127721 (2000-10-01), Narayan et al.
patent: 6242792 (2001-06-01), Miura et al.
patent: 6300252 (2001-10-01), Ying et al.
patent: 6335229 (2002-01-01), Pricer et al.
patent: 6392300 (2002-05-01), Koike
patent: 1-225135 (1989-09-01), None
patent: 8-274178 (1996-10-01), None
patent: 11-214389 (1999-08-01), None
IBM Technical Disclosure Bulletin, vol. 32, No. 3A, Aug. 1989, Fuse Structure for Wide Fuse Materials Choice, pp. 438-439.
Silicon Nitride Coatings on Copper, Audisio et al., vol. 119, No. 4, Apr. 1972, Electrochemical Society, pp. 408-411.
Daubenspeck Timothy H.
McDevitt Thomas L.
Motsiff William T.
Nye, III Henry A.
Everhart Caridad
Sabo William D.
Schmeiser Olsen & Watts
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