Semiconductor device manufacturing: process – Chemical etching
Reexamination Certificate
2005-03-29
2005-03-29
Chen, Kin-Chan (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
C438S613000
Reexamination Certificate
active
06872661
ABSTRACT:
A leadless plastic chip carrier has a plurality of die attach pads on which a singulated semi-conductor die is mounted. At least one row of contact pads circumscribes the plurality of die attach pads and a power/ground ring is intermediate the contact pads and the die attach pads. Wire bonds connect the semiconductor die, the contact pads and the power/ground ring. An overmold covers the semi-conductor die, the die attach pads, the power/ground ring and the contact pads such that each of the die attach pads and the contact pads has one exposed surface.
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Fan Chun Ho
Kwan Kin Pui
Lau Wing Him
McLellan Neil
Tsang Kwok Cheung
ASAT Ltd.
Chen Kin-Chan
Keating & Bennett LLP
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