Leadless plastic chip carrier with etch back pad singulation...

Semiconductor device manufacturing: process – Chemical etching

Reexamination Certificate

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Details

C438S613000

Reexamination Certificate

active

06872661

ABSTRACT:
A leadless plastic chip carrier has a plurality of die attach pads on which a singulated semi-conductor die is mounted. At least one row of contact pads circumscribes the plurality of die attach pads and a power/ground ring is intermediate the contact pads and the die attach pads. Wire bonds connect the semiconductor die, the contact pads and the power/ground ring. An overmold covers the semi-conductor die, the die attach pads, the power/ground ring and the contact pads such that each of the die attach pads and the contact pads has one exposed surface.

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