Lid cooling mechanism and method for optimized deposition of...

Coating apparatus – Program – cyclic – or time control – Having prerecorded program medium

Reexamination Certificate

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Details

C118S715000, C118S724000, C118S696000, C427S255370, C438S783000, C438S787000, C700S121000

Reexamination Certificate

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06899763

ABSTRACT:
An apparatus and method for depositing thin films. The apparatus generally comprises a process chamber having one or more walls and a lid and two heat exchangers. A first heat exchanger is coupled to the walls and a second heat exchanger is coupled to the lid. The two heat exchangers are configured to provide separate temperature control of the walls and lid. Separate control of the lid and wall temperatures inhibits reaction of the organosilane within the lid while optimizing a reaction within the chamber. The apparatus implements a method, in which a process gas comprising ozone and an organosilane are admitted through the into a processing while a substrate is heated to form a carbon-doped silicon oxide layer over the substrate. During deposition, the lid is kept cooler than the walls.

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