Surface planarization equipment for use in the manufacturing...

Details Surface planarization equipment for use in the manufacturing... Surface planarization equipment for use in the manufacturing...

2005-01-25

2005-01-25

Eley, Timothy V. (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S067000, C451S278000, C451S332000, C451S339000, C451S388000

Reexamination Certificate

active

06846224

ABSTRACT:
Surface planarization equipment of a semiconductor wafer safely transfers wafers to an unloading cassette. In addition to the unloading cassette, the surface planarization equipment includes a loading cassette configured to hold wafers awaiting surface planarization, an index table including a plurality of first rotary vacuum wafer chucks that receive wafers from the loading cassette, at least one grinding head disposed above the index table and operative to perform a planarization process on the wafers supported by the chucks, a cleaning and drying unit including a second wafer rotary vacuum chuck receiving the wafers from the index table after the planarization process is completed and from which the cleaned and dried wafers are transferred to the unloading cassette. A position detector includes one or more sensors disposed beside respective ones of the vacuum chucks to stop the chucks at desired positions. Accordingly, the wafers supported on the chucks will be oriented properly for insertion into the unloading cassette.

REFERENCES:
patent: 4667445 (1987-05-01), Kimura
patent: 6077153 (2000-06-01), Fujita et al.
patent: 6165056 (2000-12-01), Hayashi et al.
patent: RE37622 (2002-04-01), Karlsrud et al.
patent: 6379230 (2002-04-01), Hayashi et al.
patent: 20020115392 (2002-08-01), Kawashima
patent: 20030166380 (2003-09-01), Shibuki

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