Method of fabricating memory cell with vertical transistor

Details Method of fabricating memory cell with vertical transistor Method of fabricating memory cell with vertical transistor

2001-05-15

2002-03-12

Chaudhari, Chandra (Department: 2813)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

Having insulated gate

C438S244000, C438S589000

Reexamination Certificate

active

06355529

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method of fabricating memory cell with transistor, and more particularly to a dynamic random access memory (DRAM) cell having a vertical transistor.
2. Description of the Prior Art
A DRAM cell comprises a metal-oxide-semiconductor field effect transistor (MOSFET) and a capacitor that are built in a semiconductor silicon substrate. There is an electrical contact between the drain of a MOSFET and the bottom storage electrodes of the adjacent capacitor, forming a memory cell of the DRAM device. A large number of memory cells make up the cell arrays which combine with the peripheral circuit to produce DRAMs.
In recent years, the sizes of the MOSFETs have continuously shrunk so that the packing densities of these DRAM devices have increased considerably. For example, new techniques for manufacturing extremely small transistor elements have been developed for 1 Giga bit DRAMs and beyond. One of the methods of increasing integration is to form a three-dimensional transistor structure, instead of the commonly used planar-type transistor.
Referring to
FIG. 1A
, a semiconductor substrate
100
is provided. A pad oxide layer
102
is formed on the substrate
104
by using an oxidation process. Then, a pad nitride layer
106
and a BPSG layer (not shown) are formed by LPCVD process on the pad oxide
102
. The BPSG layer, the pad nitride layer
106
, the pad oxide layer
102
and the substrate
100
are defined to form a deep trench
112
by photolithography and etching process. Then, the BPSG layer is removed. At the lower portion of the trench
112
, a trench capacitor (not shown) is formed by using conventional process. Then, a thin collar oxide layer
114
is formed on the sidewalls of the upper portion of the deep trench
112
that are above the trench capacitor. A polysilicon layer
116
is formed and fills up the inner space of the deep trench
112
.
Referring to
FIG. 1B
, the polysilicon layer
116
is etched back until the surface of the polysilicon layer
116
in the deep trench
112
is lower than the surface of the substrate
104
. Then, the collar oxide layer
114
over the top surface of the polysilicon
116
is over-etched until the top of the collar oxide layer
114
is lower than the top surface of the polysilicon layer
116
.
Referring to
FIG. 1C
, a doped polysilicon layer (not shown) is deposited on the surface of the pad nitride layer
106
and fills the inner space of the deep trench
112
. The doped polysilicon layer on the pad nitride layer
106
is removed by a Chemical Mechanical Polishing (CMP) process. The pad nitride layer
106
acts as an etching stop layer while removing the doped polysilicon layer. Then, the doped polysilicon layer in the deep trench
112
is etched back until the top surface of the doped polysilicon in the deep trench
112
is lower than the surface of the substrate
104
at a predetermined distance. The remained residual doped polysilicon layer in the deep trench
112
forms the buried strap
122
.
Referring to
FIG. 1D
, anti-reflection coating (ARC) layer
124
is deposited on the pad nitride layer
106
and fills the inner space of the deep trench
112
. A photoresist layer
126
is coated on the anti-reflection coating layer
124
, and then a first opening
128
is defined and formed on the photoresist layer
126
by photolithography.
Referring to
FIG. 1E
, an opening
130
is formed by anisotropically etching away the anti-reflection coating layer
124
, the pad nitride layer
106
, oxide layer
102
, the buried strap
122
, the collar oxide layer
114
, the first conductive layer
116
and the substrate
100
. The photoresist layer
126
and the residual ARC layer
124
are then removed.
Referring to
FIG. 1F
, the opening
130
is filled with an insulating layer (not shown) made of high-density plasma oxide. The pad nitride layer
106
, the pad oxide layer
102
and a portion of the insulating layer are planarized by a CMP process, and an etch-back process is performed to remove a portion of the insulating layer to the surface
104
of the substrate
100
. Then, the pad nitride layer
106
and the pad oxide layer
102
are removed by an etch-back process. Thus the insulating layer in the opening
130
forms the shallow trench isolation (STI)
136
. The impurities contained in the buried strap
122
out-diffuse into the substrate
100
to form the source region
131
because of the high temperature during the mentioned manufacturing processes.
Referring to
FIG. 1G
, a polysilicon layer (not shown), a tungsten silicide layer (not shown) and a nitride layer (not shown) are sequentially deposited on the surface of the substrate
100
and STI
136
. Then, the gates
145
and the second word lines
138
are formed on the surface of the substrate
100
and STI
136
by defining the polysilicon layer, the tungsten silicide layer and the nitride layer by photolithography and anisotropic etching. A drain region
125
is formed by using the gates
145
as the mask and implanting N type dopants such as P or As into the substrate
100
. Thus, the manufacturing of a memory cell is completed.
Since the packing density of the DRAM increases and the size of the transistors and capacitors continuously scales down, the distance between the source region
131
and the drain region
125
is shortened. Accordingly, the source region
131
tends to overlap with the drain region
125
in the conventional manufacturing process, causing that the gates
145
loss the switching function and the device always turns on. That is, the memory device can not work.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a method for fabricating a semiconductor memory device having a vertical transistor that can prevent the drain region and the source region from short-circuiting.
According to this invention, a new method of fabricating a semiconductor memory device having a vertical transistor is set forth. The vertical transistor is fabricated in the trench instead of on the surface of the substrate. The gate of the transistor is located in the trench and extends to the surface of the substrate and the shallow trench isolation. The source region and the drain region are then fabricated perpendicularly to each other, and will be no longer to overlap with each other. The depth of trench and the location of the gate can be controlled to avoid the overlap of the source region and the drain region. In order to achieve the above object, this invention provides a method of fabricating a vertical transistor of a memory cell which is described below. A semiconductor substrate is first provided. A pad layer is formed on the substrate. Then, a deep trench is formed in the substrate. A trench capacitor is formed at the lower portion of the deep trench. A collar oxide layer is formed on the sidewalls of the upper portion of the deep trench that is above the trench capacitor. A first conductive layer is formed above the trench capacitor with a first predetermined depth in the deep trench, and a part of the collar oxide layer above the first conductive layer is removed to form a first opening. A second conductive layer is formed to fill the first opening. The pad layer, the substrate, the second conductive layer, the collar oxide layer and the first conductive layer are defined to a second predetermined depth and have a second opening formed thereon. A first insulating layer is formed to fill the second opening and thus forms the shallow trench isolation. A part of the second conductive layer is removed to a third predetermined depth to form a buried strap and a third opening. An insulating spacer is formed on the sidewalls of the third opening. A second insulating layer is formed on the buried strap. Then, the pad layer and the insulating spacer is removed. A third insulating layer is formed on the exposed surface of the substrate, as well as the sidewalls of the third opening. A well at the upper portion of the substrate is formed. Then, the third insulat

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