Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2008-07-08
2008-07-08
Jackson, Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S192000, C257S288000, C257S401000, C257SE21431
Reexamination Certificate
active
07397091
ABSTRACT:
A CMOS device such as an NFET or a PFET and a method of forming a CMOS device are provided. The method begins by forming at least one patterned gate region atop a first semiconductor layer that includes silicon. Dielectric spacers are formed about exposed portions of the patterned gate region. Source-drain regions are formed in the first semiconductor layer. Recesses are formed in the first semiconductor layer that extends under the dielectric spacers. The first semiconductor layer has exposed surfaces that in part define sidewalls of the recesses. A nickel barrier layer is formed on each of the exposed surfaces of the first semiconductor layer. The nickel barrier layers are etched so that the nickel barriers remain only on portions of the exposed surfaces located under the dielectric spacers and not on remaining portions of the exposed surface. A silicon-containing layer is formed on the remaining exposed surfaces of the first semiconductor layer. Silicide layers are formed on the silicon-containing layers, wherein the silicide layer includes nickel.
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Diaz José R
Jackson Jerome
Mayer & Williams PC
Sony Corporation
Sony Electronics Inc.
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