Method for fabricating semiconductor package with heat sink

Details Method for fabricating semiconductor package with heat sink Method for fabricating semiconductor package with heat sink

2008-05-13

2008-05-13

Tran, Long K. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S126000, C438S127000, C257S796000, C257S787000, C257SE21050, C257SE21080

Reexamination Certificate

active

07371617

ABSTRACT:
A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof, and is attached via its bottom surface to a chip mounted on a chip carrier. The detach member is sized larger than the heat sink and can be easily removed from the top surface of the heat sink. Subsequently, a molding process is performed to form an encapsulant for completely encapsulating the chip, the heat sink and the detach member. Then, a singulation process is performed to cut along predetermined cutting lines located between sides of the heat sink and corresponding sides of the detach member. Finally, the detach member and a portion of the encapsulant formed on the detach member are removed from the heat sink. The above fabrication method reduces the packaging cost.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 5477626 (1995-12-01), Kwon
patent: 5736785 (1998-04-01), Chiang et al.
patent: 6069027 (2000-05-01), Mertol et al.
patent: 6429512 (2002-08-01), Huang et al.
patent: 6433420 (2002-08-01), Yang et al.
patent: 6444498 (2002-09-01), Huang et al.
patent: 6458626 (2002-10-01), Huang et al.
patent: 6462405 (2002-10-01), Lai et al.
patent: 6506681 (2003-01-01), Grigg et al.
patent: 6522428 (2003-02-01), Chiu et al.
patent: 6528876 (2003-03-01), Huang
patent: 2004/0212080 (2004-10-01), Chen et al.

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