Droplet ejecting apparatus, method of forming a thin film,...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

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C257SE21002, C347S033000

Reexamination Certificate

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07902085

ABSTRACT:
A droplet ejecting apparatus, method of forming a thin film, and a substrate for a display device, wherein a droplet ejecting apparatus includes a first ejecting unit ejecting a first droplet on a substrate, a second ejecting unit ejecting a second droplet on the substrate along a path defined by a movement of the first ejecting unit, and a transporting unit connected with the first ejecting unit and the second ejecting unit to transport the first ejecting unit and the second ejecting unit.

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patent: 2003-159787 (2003-06-01), None

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