Method of manufacturing semiconductor devices

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S268000, C438S269000, C438S271000, C438S272000, C438S273000

Reexamination Certificate

active

07927952

ABSTRACT:
A method of manufacturing semiconductor devices comprises forming an semiconductor layer of the first conduction type on a substrate of the first conduction type; forming an anti-oxidizing layer on the surface of the semiconductor layer of the first conduction type, the anti-oxidizing layer having an aperture only through a region for use in formation of a guard ring layer of the second conduction type; forming the guard ring layer of the second conduction type in the surface of the semiconductor layer of the first conduction type through implantation of ions into a surface where said anti-oxidizing layer is formed; forming an oxide layer at least in the aperture; forming a base layer of the second conduction type adjacent to the guard ring layer of the second conduction type in the surface of the semiconductor layer of the first conduction type; and forming a diffused layer of the first conduction type through implantation of ions into the base layer of the second conduction type.

REFERENCES:
patent: 4868135 (1989-09-01), Ogura et al.
patent: 5963799 (1999-10-01), Wu
patent: 6127247 (2000-10-01), Wu
patent: 6198131 (2001-03-01), Tung
patent: 6258670 (2001-07-01), Tung
patent: 6465308 (2002-10-01), Cheng et al.
patent: 6563169 (2003-05-01), Miyakoshi et al.
patent: 2002/0127793 (2002-09-01), Murata et al.
patent: 2003/0034531 (2003-02-01), Kanda et al.
patent: 2005/0202637 (2005-09-01), Chiola
patent: 2007/0128788 (2007-06-01), Lee et al.
patent: 8-274313 (1996-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2740839

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.