Manufacturing method of flexible semiconductor device and...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257SE29291, C257S057000

Reexamination Certificate

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07977741

ABSTRACT:
A layered film of a three-layer clad foil formed with a first metal layer23, a second metal layer25, and an inorganic insulating layer35interposed therebetween is prepared. After the second metal layer25is partially etched to form a gate electrode20g, the first metal layer23is partially etched to form source/drain electrodes20s,20din a region corresponding to the gate electrode20g. A semiconductor layer40is then formed in contact with the source/drain electrodes20s,20dand on the gate electrode20gwith the inorganic insulating layer35interposed therebetween. The inorganic insulating layer35on the gate electrode20gfunctions as a gate insulating film30, and the semiconductor layer40between the source/drain electrodes20s,20don the inorganic insulating layer35functions as a channel.

REFERENCES:
patent: 5580796 (1996-12-01), Takizawa et al.
patent: 7176697 (2007-02-01), Dahan
patent: 2005/0194606 (2005-09-01), Oohata
patent: 2006/0157772 (2006-07-01), Sumida et al.
patent: 2008/0035920 (2008-02-01), Takechi et al.
patent: 2008/0121885 (2008-05-01), Kuo
patent: 2008/0210946 (2008-09-01), Okada et al.
patent: 2008/0217617 (2008-09-01), Sugawa et al.
patent: 2008/0258138 (2008-10-01), Song et al.
patent: 2009/0045402 (2009-02-01), Kuo
patent: 2009/0108280 (2009-04-01), Jan et al.
patent: 2009/0108371 (2009-04-01), Nakayama et al.
patent: 2009/0209069 (2009-08-01), Hirakata et al.
patent: 2010/0151622 (2010-06-01), Suh et al.
patent: 2010/0173451 (2010-07-01), Cho et al.
patent: 2010/0261321 (2010-10-01), Hirano et al.
patent: 2010/0276691 (2010-11-01), Ichiryu et al.
patent: 2003-258261 (2003-09-01), None
patent: 2005-123290 (2005-05-01), None
patent: 2005-166742 (2005-06-01), None
patent: 2005-294300 (2005-10-01), None
patent: 2006-186294 (2006-07-01), None
patent: 2007-067263 (2007-03-01), None
patent: 2007-073857 (2007-03-01), None
U.S. Notice of Allowance issued in U.S. Appl. No. 12/518,602, mailed Sep. 7, 2010.

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