4. Measuring and testing
  5. Volume or rate of flow
  6. By measuring electrical or magnetic properties

Shingo Komatsu

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Circuit component built-in module with embedded...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Circuit component built-in module with embedded...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Component built-in module and method for producing the same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Component built-in module and method for producing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Component built-in module and method for producing the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1632731

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