Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-04-19
2011-04-19
Zarneke, David A (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S125000, C257SE25027, C257S773000, C257S723000, C257S686000
Reexamination Certificate
active
07927918
ABSTRACT:
An apparatus and a method for packaging semiconductor devices. The apparatus is a three-dimensional electronic package comprising one or more electronic components, a plurality of electrical contact pads, and a plurality of electrically conductive three-dimensional plugs formed through an encapsulant. Specific ones of the plurality of electrical contact pads are electrically coupled to the one or more electronic components on an uppermost surface of the plurality of electrical contact pads. The encapsulant is formed over and covers the one or more electronic devices. The plurality of three-dimensional plugs have a first end extending from at least the uppermost portion of one or more of the plurality of electrical contact pads and a second end extending substantially to an uppermost surface of the encapsulant.
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Atmel Corporation
Schwegman Lundberg & Woessner, P.A.
Zarneke David A
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