Integrated circuit package on package system

Details Integrated circuit package on package system Integrated circuit package on package system

2011-07-26

2011-07-26

Arora, Ajay K (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S704000, C257SE27137, C257SE27144, C438S108000

Reexamination Certificate

active

07986043

ABSTRACT:
An integrated circuit package on package system including forming an interconnect integrated circuit package and attaching an extended-lead integrated circuit package on the interconnect integrated circuit package wherein a mold cap of the extended-lead integrated circuit package faces a mold cap of the interconnect integrated circuit package.

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