Microelectromechanical systems encapsulation process

Details Microelectromechanical systems encapsulation process Microelectromechanical systems encapsulation process

2011-03-01

2011-03-01

Le, Thao P. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S433000

Reexamination Certificate

active

07898046

ABSTRACT:
An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.

REFERENCES:
patent: 5470627 (1995-11-01), Lee et al.
patent: 5683591 (1997-11-01), Offenberg
patent: 6808953 (2004-10-01), Partridge
patent: 6869879 (2005-03-01), Ryan
patent: 6902656 (2005-06-01), Ouellet et al.
patent: 6930367 (2005-08-01), Lutz et al.
patent: 6936491 (2005-08-01), Partridge
patent: 6936902 (2005-08-01), Reichenbach
patent: 6939809 (2005-09-01), Partridge
patent: 6952041 (2005-10-01), Lutz
patent: 2002/0187647 (2002-12-01), Dhindsa et al.
patent: 2003/0183916 (2003-10-01), Heck et al.
patent: 2003/0187555 (2003-10-01), Lutz
patent: 2003/0211650 (2003-11-01), Martin
patent: 2004/0124481 (2004-07-01), Partridge
patent: 2004/0124483 (2004-07-01), Partridge
patent: 2004/0163476 (2004-08-01), Partridge
patent: 2004/0183214 (2004-09-01), Partridge
patent: 2004/0207489 (2004-10-01), Lutz
patent: 2004/0209435 (2004-10-01), Partridge
patent: 2004/0245586 (2004-12-01), Partridge
patent: 2004/0248344 (2004-12-01), Partridge
patent: 2005/0014374 (2005-01-01), Partridge
patent: 2005/0019974 (2005-01-01), Lutz
patent: 2005/0073078 (2005-04-01), Lutz
patent: 2005/0095833 (2005-05-01), Lutz
patent: 2005/0106318 (2005-05-01), Partridge
patent: 2005/0142688 (2005-06-01), Partridge
patent: 2005/0151592 (2005-07-01), Partridge
patent: 2005/0156260 (2005-07-01), Partridge
patent: 2005/0162239 (2005-07-01), Lutz
patent: 2005/0179099 (2005-08-01), Lutz
patent: 2005/0195050 (2005-09-01), Lutz
patent: 2005/0242904 (2005-11-01), Lutz
patent: 2005/0253209 (2005-11-01), Lutz
patent: 2005/0255645 (2005-11-01), Lutz
patent: 2005/0260783 (2005-11-01), Lutz
patent: 2005/0288392 (2005-12-01), Okubora
patent: 2006/0290449 (2006-12-01), Piazza et al.
patent: 2007/0196945 (2007-08-01), Martin
patent: 2008/0055703 (2008-03-01), Pan
patent: 2008/0138580 (2008-06-01), Low et al.
D. Gao, W. R. Ashurst, C. Carraro, R. T. Howe, R. Maboudian, “Silicon Carbide for Enhanced MEMS Reliability,”In the Proceeding of the 2004 Sensors and Actuators Workshop, Hilton Head, S.C., 2004.
R. Candler, W.-T. Park, H. Li, G. Yama, A. Partridge, M. Lutz, T. Kenny, Single Wafer Encapsulation of MEMS DevicesIn IEEE Transactions on Advanced Packaging, pp. 227-232, vol. 26, No. 3, 2003.
A. Partridge, A. Rice, T. W. Kenny, M. Lutz, “New thin film epitaxial polysilicon encapsulation for piezoresistive accelerometers,” unidentified IEEE publication, p. 54-59, 2001.

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