Methods for forming packaged products

Details Methods for forming packaged products Methods for forming packaged products

2011-07-19

2011-07-19

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000, C438S675000, C438S617000, C438S123000

Reexamination Certificate

active

07981796

ABSTRACT:
An apparatus and methods for packaging semiconductor devices are disclosed. The apparatus is applicable to many types of contemporary packaging schemes that utilize a sacrificial metal base strip. Tunnels formed through an encapsulation area surrounding the device and associated bond wires are filled with a metallic conductor by, for example, electroplating, and extend bottom contact pads to an uppermost portion of the encapsulated area. The sacrificial metal base strip serves as a plating bus and is etch-removed after plating. The filled tunnels allow components to be stacked in a three-dimensional configuration.

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