Measuring and testing – Surface and cutting edge testing – Roughness
Reexamination Certificate
2011-04-19
2011-04-19
Larkin, Daniel S (Department: 2856)
Measuring and testing
Surface and cutting edge testing
Roughness
C850S018000, C850S040000, C850S052000, C850S056000, C850S063000, C977S962000
Reexamination Certificate
active
07926328
ABSTRACT:
There is provided a sample manipulating apparatus which is an apparatus for manipulating a sample mounted on a substrate surface, in which at least position data and shape data are acquired by observing the sample. Thereafter, tweezers are positioned by moving means such that the sample is positioned between an observing probe and a grasping probe based on the two set of data. After positioning, a height of the tweezers is set to a position of being remote from the substrate surface by a constant distance by moving means while monitoring a result of measurement by displacement measuring means. Thereafter, the grasping probe is moved to a side of the observing probe while monitoring the result of measurement by the displacement measuring means at the set height and the sample is grasped while detecting a grasping start point.
REFERENCES:
patent: 6862921 (2005-03-01), Chand et al.
patent: 7574903 (2009-08-01), Su et al.
patent: 7770474 (2010-08-01), Yasutake et al.
patent: 2008/0105044 (2008-05-01), Yasutake et al.
Takekawa et al., “Development in AFM Tweezers for Manipulation of Nanometer Size Objects”, Transaction of the Institute of Electrical Engineers of Japan, E2005, vol. 125, No. 11, pp. 448-453, 2005.
Umemoto Takeshi
Watanabe Masafumi
Yasutake Masatoshi
Brinks Hofer Gilson & Lione
Larkin Daniel S
SII Nano Technology Inc.
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