Polyamide containing the hexafluoroisopropylidene group and proc

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

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430165, 430191, 430192, 430193, 528185, 528335, 528338, 528339, 4284744, 4284752, G03F 732, G03F 7023, C08G 6300

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052408191

ABSTRACT:
This invention is that of high temperature polyamides containing the hexafluoroisopropylidene group. The high temperature polyamides of the invention and photo or radiation sensitizers provide improved high temperature positive resists which can be developed in aqueous alkaline developer and thermally anneal to form heat resistant, polyoxazole relief structures suitable for use in microelectronic and printing applications. The positive photoresists of the invention have improved solubility in coating solvents and improved photospeed. The polyamides of the invention can be prepared by conventional condensation reactions; e.g. the condensation of a diamine and diacid chloride. In addition the polyamides of this invention provide high temperature protective coatings with superior adhesion properties in applications other than the photoresist area.

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patent: 4339521 (1982-07-01), Ahne et al.
patent: 4622285 (1986-11-01), Ahne
patent: 4939215 (1990-07-01), Mueller et al.
patent: 5021320 (1991-06-01), Mueller et al.
patent: 5037720 (1991-08-01), Khanna
patent: 5077378 (1991-12-01), Mueller et al.

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