Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1996-10-30
1999-07-13
Bowers, Charles
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
438282, 438151, 438589, 257262, H01L 2100, H01L 21265
Patent
active
059239808
ABSTRACT:
A method of forming an IGFET includes forming a trench in a substrate, forming spacers on opposing sidewalls of the trench, forming a gate insulator on a bottom surface of the trench between the spacers, forming a gate electrode on the gate insulator and the spacers, removing at least portions of the spacers to form voids in the trench after forming the gate electrode, implanting localized source and drain regions through the voids and through the bottom surface of the trench outside the gate electrode, and forming a source and drain in the substrate that include the localized source and drain regions adjacent to the bottom surface of the trench. The localized source and drain regions provide accurately positioned channel junctions beneath the trench. Furthermore, the dopant concentration of the localized source and drain regions is controlled by the amount of the spacers, if any, left intact when the localized source and drain regions are implanted after removing the portions of the spacers.
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Fulford Jr. H. Jim
Gardner Mark I.
Hause Frederick N.
Advanced Micro Devices , Inc.
Blum David S.
Bowers Charles
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