Method of making greek letter psi shaped capacitor for DRAM circ

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438675, H01L 218242

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active

059239735

ABSTRACT:
A method of forming a capacitor having a cross section shape similar to the Greek letter psi. The shape of the capacitor plate provides a high capacitance using a modest amount of chip area. A capacitor hole is etched in a thick layer of a first dielectric. A layer of polysilicon is formed on the dielectric layer covering the sidewalls and bottom of the capacitor hole. A second dielectric is then used to fill the hole. A contact hole in the second dielectric extends to the contact region of the wafer and is filled with a polysilicon plug. The polysilicon plug and the polysilicon covering the sidewalls and bottom of the capacitor hole form the first capacitor plate. A layer of hemispherical grain polysilicon can be used to further increase the surface area of the first capacitor plate.

REFERENCES:
patent: 5174858 (1992-12-01), Yamamoto et al.
patent: 5389568 (1995-02-01), Yan
patent: 5492850 (1996-02-01), Ryou
patent: 5550076 (1996-08-01), Chen
patent: 5554557 (1996-09-01), Roh
patent: 5571742 (1996-11-01), Jeong
patent: 5817554 (1998-10-01), Tseng

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