Wiring between semiconductor integrated circuit chip electrode p

Details Wiring between semiconductor integrated circuit chip electrode p Wiring between semiconductor integrated circuit chip electrode p

1996-12-24

1999-07-13

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

257666, 257695, 257670, H01L 23495, H01L 2304, H01L 2348

Patent

active

059230924

ABSTRACT:
A semiconductor IC device requiring dense arrangements of I/O connections in which a plurality of electrode pads are arranged in a rectangular form for a quad surface mounting type package, corner electrode pads are arranged to be shifted toward inside of a semiconductor chip for reducing the distance of corner bonding wires, or corner inner leads are bent and further extended toward the chip for making shorter the span length of the corner bonding wires, so that wire sweeping and electrical shorting of the corner bonding wires during a wire bonding and a molding processes can be prevented and the reliability of the bonding wires can be improved.

REFERENCES:
patent: 4999700 (1991-03-01), Dunaway et al.
patent: 5270570 (1993-12-01), Westerkamp
patent: 5327008 (1994-07-01), Djennas et al.
patent: 5466968 (1995-11-01), Okumura et al.
patent: 5637913 (1997-06-01), Kajihara et al.

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