Method for forming a high surface area capacitor electrode for D

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438253, 438255, 438398, 438964, 257309, 257915, H01L 218242, H01L 2120, H01L 27108, H01L 2912

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active

061141984

ABSTRACT:
A process for creating a capacitor structure, for a DRAM device, in which the capacitance has been increased via use of a high dielectric constant capacitor dielectric layer, and via the use of a storage node electrode, comprised of a top surface HSG layer, has been developed. The process features deposition of an HSG TiN layer, used as part of a storage node structure, resulting in an increase in storage node electrode surface area, and thus an increase in capacitance.

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