Semiconductor device having a perforated base film sheet

Details Semiconductor device having a perforated base film sheet Semiconductor device having a perforated base film sheet

1995-09-18

1998-06-09

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257686, 257774, H01L 23495, H01L 2302

Patent

active

057639396

ABSTRACT:
In a semiconductor device which has a base film sheet to support a semiconductor chip in a center region of the base film sheet, a plurality of via holes are formed within a peripheral region of the base film sheet. The via holes may be used to mount a metal plate on the base film sheet or to support another semiconductor chip, by forming ball bumps on or in the via holes. A circuit board may be attached to the base film sheet by the use of the bumps or pins extended through the via holes.

REFERENCES:
patent: 5045914 (1991-09-01), Casto et al.
patent: 5045921 (1991-09-01), Lin et al.
patent: 5291062 (1994-03-01), Higgins, III
Patent Abstract of Japan JP 56 134743 Oct. 21, 1981.

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