Polyphosphazene binder resins for photoresists comprising as pho

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

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430165, 430191, 430192, 430193, 430270, 430272, 430330, 430905, 528168, 528399, G03F 7023, G03F 732, G03C 173

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052485854

ABSTRACT:
This invention relates to novel radiation sensitive compositions. More particularly the invention relates to photoresists containing phosphorus and nitrogen linked polymers; i.e., polyphosphazenes, useful in the preparation of a relief pattern on a substrate; e.g., a silicon wafer or aluminum plate. The polyphosphazenes of in this invention can be synthesized by the condensation of N-trimethylsilylalkoxyphosphorimides. Radiation sensitive positive photoresist compositions of the invention can be developed in aqueous base developer or organic solvent developer The base developer dissolution properties of the composition can be controlled by incorporating carboxylate groups into the polyphosphazene. The polyphosphazenes utilized in this invention have good solubility properties in various organic solvents and also have good mechanical, electrical, adhesion and thermal properties.

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"ESCA and Mass Spectroscopic Studies of Degradations of Poly[bis(trifluoroethoxy)phosphazene]: Pyrolysis, Ultraviolet Light, and Electron Beam Induced Degradations" by H. Hiraoka, W. Lee, L. W. Welsh, Jr. and R. W. Allen, Macromolecules, vol. 12, No. 4, Jul.-Aug. 1979.

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