Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1997-01-22
1998-12-22
Tsai, Jey
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
438264, H01L 21336
Patent
active
058518797
ABSTRACT:
A method for fabricating compact contactless trenched flash memory array for semiconductor EEPROM devices is disclosed. The flash memory array comprises a number of memory cell units. Each of the cell units comprises a body line, source and drain regions and a stacked gate constructed over a silicon wafer substrate. The source and drain regions are buried regions and the body line is isolated by the surrounding buried source/drain regions and trenches formed to cut deep down to the substrate of the wafer. The stacked gate includes a first polysilicon layer, an oxide-nitride-oxide configuration, a second polysilicon layer, a pad oxide layer and a nitride layer. The source and drain buried regions sandwiches the body line, and the stacked gate substantially sits directly atop the body line. The flash memory array is free from the serious problem of short channel effect.
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"A Novel memory Cell Using Flash Array Contactless EPROM (FACE) Technology," 1990, IEDM, pp., 90-94.
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Hong Gary
Hsu Ching-Hsiang
Lin Ruei-Ling
Lebentritt Michael S.
Tsai Jey
United Microelectronics Corporation
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