Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1995-07-14
2000-08-15
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
H01L 2100
Patent
active
061030554
ABSTRACT:
A substrate processing system is provided that includes substrate processing vessels, a substrate queuing station, a substrate transfer device, and a processor. The processor, in communication with the processing vessels, the queuing station, and the transfer device, provides selectable single and multi-step processing of the substrates by accessing a process command for a given substrate corresponding to desired processing of the substrate.
REFERENCES:
patent: D275032 (1984-08-01), Maher, Jr. et al.
patent: 3765763 (1973-10-01), Nygaard
patent: 3973665 (1976-08-01), Giammanco
patent: 4094722 (1978-06-01), Yamamoto et al.
patent: 4149923 (1979-04-01), Uehara et al.
patent: 4208159 (1980-06-01), Uehara et al.
patent: 4264706 (1981-04-01), Sutton et al.
patent: 4311427 (1982-01-01), Coad et al.
patent: 4318767 (1982-03-01), Hijikata et al.
patent: 4381965 (1983-05-01), Maher, Jr. et al.
patent: 4405435 (1983-09-01), Tateishi et al.
patent: 4473435 (1984-09-01), Zafiropoulo et al.
patent: 4477311 (1984-10-01), Mimura et al.
patent: 4483651 (1984-11-01), Nakane et al.
patent: 4498416 (1985-02-01), Bouchaib
patent: 4534314 (1985-08-01), Ackley
patent: 4542712 (1985-09-01), Sato et al.
patent: 4547247 (1985-10-01), Warenback et al.
patent: 4548699 (1985-10-01), Hutchinson et al.
patent: 4550239 (1985-10-01), Uehara et al.
patent: 4560462 (1985-12-01), Radford et al.
patent: 4563240 (1986-01-01), Shibata et al.
patent: 4584045 (1986-04-01), Richards
patent: 4587002 (1986-05-01), Bok
patent: 4592306 (1986-06-01), Gallego
patent: 4622918 (1986-11-01), Bok
patent: 4650064 (1987-03-01), Slabaugh
patent: 4657618 (1987-04-01), Spencer et al.
patent: 4661196 (1987-04-01), Hockersmith et al.
patent: 4661228 (1987-04-01), Mintz
patent: 4664062 (1987-05-01), Kamohara et al.
patent: 4668338 (1987-05-01), Maydan et al.
patent: 4668365 (1987-05-01), Foster et al.
patent: 4670126 (1987-06-01), Messer et al.
patent: 4674621 (1987-06-01), Takahashi
patent: 4675096 (1987-06-01), Tateishi et al.
patent: 4705951 (1987-11-01), Layman et al.
patent: 4713551 (1987-12-01), Layman et al.
patent: 4715764 (1987-12-01), Hutchinson
patent: 4715921 (1987-12-01), Maher et al.
patent: 4717461 (1988-01-01), Strahl et al.
patent: 4724621 (1988-02-01), Hobson et al.
patent: 4756815 (1988-07-01), Turner et al.
patent: 4763602 (1988-08-01), Madan et al.
patent: 4770590 (1988-09-01), Hugues et al.
patent: 4775281 (1988-10-01), Prentakis
patent: 4776918 (1988-10-01), Otsubo et al.
patent: 4825808 (1989-05-01), Takahashi et al.
patent: 4851101 (1989-07-01), Hutchinson
patent: 4852516 (1989-08-01), Rubin et al.
patent: 4909695 (1990-03-01), Hurwitt et al.
patent: 4951601 (1990-08-01), Maydan et al.
patent: 5013385 (1991-05-01), Maher et al.
patent: 5013400 (1991-05-01), Kurasaki et al.
patent: 5076205 (1991-12-01), Vowles et al.
patent: 5308431 (1994-05-01), Maher et al.
Chapman, B., "Glow Discharge Processes--Sputtering and Plasma Etching," Plasma Etching, John Wiley & Sons, Inc., NY, 1980, pp. 326-329.
"Dry Etching Systems," Semiconductor International, Oct. 1985, pp. 49-60.
Drytek Brochure entitled "Quad Systems," Drytek Inc. 1985, consisting of 11 pages of advertisement, published by Drytek, Inc., 16 Jonspin Road, Wilmington, MA 01887.
Horiike, Y., "Emerging Etching Techniques," VLSI Electronics Microstructure Science, vol. 8, Academic Press, Inc. (Harcourt Brace Jovanovich, Publishers), 1984, pp. 448-450.
IBM Technical Disclosure Bulletin, vol. 29, No. 1, Jun. 29, 1986, entitled "Vacuum-Compatible Wafer Handler."
Itakura, H., Komiya, H., and Ukai, K., "Multi-Chamber Dry Etching System," Solid State Technology, Apr. 1982, pp. 209-214.
Maher, Jr., J.A., "Plasma Etching of Aluminum and Its Alloys," LFE Corporation, Process Control Div., 1601 Trapelo Rd., Waltham, MA 02154, believed to have been published as an application note in 1978-1979 and presented.
Moleshi, M.M.; Fu, C.Y.; Sigmon, T.W.; and Saraswat, K.C., "Low-temperature direct nitridation of silicon in nitrogen plasma generated by microwave discharge," J. Appl. Phys. 58 (6), Sep. 15, 1985, pp. 2416-2419.
Declaration of Mr. Mark W. Miller dated Dec. 21, 1989, filed in appl. S/N 07/115,774 consisting of 9 pages of Declaration and 30 pages of enclosures to the Declaration.
Ulvac Corporation, "Sputtering Systems, Dry Etching Systems and Its Applications" (believed to have been published in 1983).
Semiconductor International, "Contents", vol. 8, No. 10, Oct., 1985.
Plasma Industry Service, Synopsis Report, Salzer Technology Enterprises Inc., Dec., 1983.
Tegal, Detailed Technical Specifications.
Lavine, R.E., "Thin Film Sputtering Improved by Handling Disks Individually", Vacuum Technology Research and Division, Mar. 1985, pp. 111-115.
Brooks Automation, Wafer Handling Products (date unknown and not admitted to be prior art).
"Automated Wafer Processing", SME Technical Paper, EMTAS '84 Conference Oct. 9-11, 1984, by J. Gililland, pp. 1-7, 1984.
"Wafer Fabrication and Process Automation Research at Stanford University", Solid State Technology, by B.K. Reid, et al., pp. 126-132, Jul. 1984.
"Computer Automated IC Manufacturing Demands ULSI Wafers", Solid State Technology, by H.R. Huff, et al., pp. 193-194, Sep. 1985.
"Processing and Device Technology Advancements", IEEE International Solid-State Circuits Conference, by Ning-Gau Wu, pp. 208-209, Feb. 15, 1980.
Fully Automated LSI Fabrication Technology Using Wafer Cassette Transportation System, IEEE Service Cent. (Cat. No. 82CH1822-6), by M. Miyake, et al., pp. 66-67, 1982.
"Automated Semiconductor Line Speeds Custom Chip Production", Electronics, by R.Burnner, et al. vol. 54, No. 2, pp. 121-127, Jan. 27, 1981.
"Computer-Aided LSI Circuit Manufacturing Process Control", IEEE, by E.George Smith, pp. 248-250, 1980.
"The One-Month Chip: Fabrication", IEEE Spectrum, by M.A. Fischetti, vol. 21, No. 9, pp. 35-39, Sep. 1984.
"Casey Jones Would Have Manufactured His IC Devices This Way", Industrial Research, by P.G. Borden, et al., vol. 25, p. 99, Jul. 1983.
"Gear Cos. Inch to Integrated Fab Lines in Anti-Contaminant Drive", Electronic News, by Mark Mehler, vol. 29, p. 1, May 30, 1983.
"Backed by Significant Venture Capital, Chip Start-Ups Flourish", Computerworld, Aug. 27, 1984.
"Automated Semiconductor Line Speeds Custom Chip Production", Electronics, Jan. 27, 1981, International Edition.
"Automatic Microprocessor Control of Continuous In-Line Aluminum Deposition on Silicon Wafers", American Inst. Chem. Engrs., New York, NY, by M.M. Kuljian, pp. 266-270, 1979.
"Advances in Wafer Process Control", Solid State Technology, by K. Schuegraf, vol. 23, No. 2, pp. 87-94, Feb. 1980.
"Automated Semiconductor Vacuum Chemical Vapor Deposition Facility (Final Report)", NTIS Accession Number: N82-2058/1, 9 pgs., 1982.
"Wafer Handling Robot", Solid State Technology, vol. 28, No. 1, p. 74 Jan. 1985.
"Automation in Semiconductor Manufacturing", IEEE Proceedings of the International Electron Devices Meeting, by T. Makimoto, et al., pp. 11-15, 1982.
"Automation of Front-End Processing Equipment for VLSI Fabrication, "Semicon/West Technical Proceedings, pp. 99-105, 1983.
The System 1000, The Semi Group RIE System 100 TC, 6 pages, believed to be published sometime before Mar., 1985, printed in California and available as a machine data sheet in the United States.
GIR 200, Plasma Cassette to Cassette R.I.E.-Planar Plasma Etcher, CIT Alcatel, 10 pages, believed to be published sometime before Feb., 1984, printed in France and available as a machine data sheet in the United States.
Omni-Etch 10000 Dry Processing System, Perkin-elmer, 8 pages, dated Sep., 1982, available as a machine data sheet in the United States.
Vactronic PDS-5000 Distributed Multichamber Plasma Processing System, 4 pages, believed to be available sometime in 1981, printed in New York and available as a machine data sheet in the United States.
AutoEtch 480 . . . , 3 pages, believed to be published by Apr., 1982, and available as a machine data sheet in the United States.
Reactive Ion Etching Parameters, Anelva, 4 pages, dated Jan., 1981, printed in California and available as a m
Maher Joseph A.
Miller Mark W.
Napoli Joseph D.
Vowles E. John
Zafiropoulo Arthur W.
Applied Materials Inc.
Powell William
LandOfFree
System for processing substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System for processing substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for processing substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2002702