Semiconductor wafers having test circuitry for individual dies

Details Semiconductor wafers having test circuitry for individual dies Semiconductor wafers having test circuitry for individual dies

1993-10-08

1995-02-21

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

371 212, 257203, H01L 2166, H01L 2160

Patent

active

053918924

ABSTRACT:
A semiconductor wafer comprises a plurality of individual dies containing integrated circuits which are substantially isolated from each other. The wafer is severable between the dies to physically singulate the dies from each other. The wafer includes test cycling circuitry for test cycling the individual dies. A Vcc bus and a Vss bus overly a passivation layer and are electrically connected through the passivation layer with Vcc and Vss pads associated with the individual dies.

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