Method of forming polysilicon local interconnects

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438766, 438764, 438918, 438966, 438162, 438165, 438491, 438528, 438532, 438659, H01L 21336

Patent

active

057803471

ABSTRACT:
A method and apparatus of forming local interconnects in a MOS process deposits a layer of polysilicon over an entire region after several conventional MOS processing steps. The region is then masked to provide protected regions and unprotected regions. The mask may be used to define local interconnects and other conductive elements such as the source and drain contact regions for a MOS transistor. After masking, the region is bombarded with atoms to enhance the oxidation potential of the unprotected regions. The masking is removed and the substrate is then exposed to oxidizing conditions which cause the unprotected regions to rapidly oxidize to form a thick oxide layer. The formerly protected polysilicon regions may then be doped to render them conductive. The method reduces the number of steps required for formation of local interconnects, permits self-planarization, and avoids excessive etching of polysilicon during the formation of the various conductive regions in a structure that includes source and drain electrodes and local interconnects within the commonly-prepared layer of conductive polysilicon.

REFERENCES:
patent: 3634203 (1972-01-01), McMahon
patent: 3775262 (1973-11-01), Heyerdahl
patent: 3966501 (1976-06-01), Nomura et al.
patent: 4143178 (1979-03-01), Harada
patent: 4356211 (1982-10-01), Riseman
patent: 4818711 (1989-04-01), Choksi et al.
patent: 5219768 (1993-06-01), Okita
patent: 5252517 (1993-10-01), Blalock et al.
patent: 5269877 (1993-12-01), Bol
patent: 5393676 (1995-02-01), Anjum et al.
patent: 5460983 (1995-10-01), Hodges et al.
patent: 5682052 (1997-10-01), Hodges et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming polysilicon local interconnects does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming polysilicon local interconnects, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming polysilicon local interconnects will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1881232

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.