Method of etching back of tungsten layers on semiconductor wafer

Details Method of etching back of tungsten layers on semiconductor wafer Method of etching back of tungsten layers on semiconductor wafer

1990-06-24

1991-02-12

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156638, 156639, 156645, 156656, 156667, 156903, 252 795, 437228, 437245, B44C 122, C23F 100, C03C 1500, C03C 2506

Patent

active

049921355

ABSTRACT:
Disclosed is a method of etching back a tungsten layer on a semiconductor wafer by a polishing process. The method comprises:

REFERENCES:
patent: 4295923 (1981-10-01), Kasper
patent: 4956313 (1990-09-01), Cote et al.

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