Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1999-02-17
2000-06-27
Chu, John S.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430905, 430910, G03F 7004
Patent
active
060805242
ABSTRACT:
A photoresist composition including a photoacid generator and a photosensitive polymer for use in a chemically amplified photoresist that is represented by the following chemical formula (CF1): ##STR1## wherein R.sub.1 is a C.sub.1 to C.sub.20 aliphatic hydrocarbon; R.sub.2 is selected from the group including t-butyl, tetrahydropyranyl and 1-alkoxyethyl groups; l, m, and n are integers, and wherein l/(l+m+n)=0.1-0.5, m/(l+m+n)=0.1-0.7, and n/(l+m+n)=0.0-0.4. The photosensitive polymer has a cyclic backbone containing an alicyclic compound, which has high resistance to dry etching, and is used with excimer lasers to create a fine pattern line.
REFERENCES:
patent: 5879857 (1999-03-01), Chandross et al.
patent: 5962191 (1999-10-01), Nozaki et al.
patent: 5981142 (1999-11-01), Jung et al.
Chu John S.
Samsung Electronics Co,. Ltd.
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