Semiconductor device with smaller package having leads with alte

Details Semiconductor device with smaller package having leads with alte Semiconductor device with smaller package having leads with alte

1995-06-05

1997-01-07

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257692, 257673, H01L 2348, H01L 23495

Patent

active

055920209

ABSTRACT:
Disclosed is a semiconductor device comprising an integrated circuit chip, a first lead having a portion extending substantially in parallel to one side plurality of the chip, and a second lead located adjacent to the first lead. Each of the first and second leads has a recess and a projection continuously. The first lead and second lead are arranged adjacent to each other with the recess and projection of the first lead being in engagement with the projection and recess of the second lead. Bonding wires are bonded on the projection of the first lead and the projection of the second lead. The bonding wires electrically connect the chip to the first lead and also to the second lead.

REFERENCES:
patent: 5276352 (1994-01-01), Komenaka et al.
patent: 5309017 (1994-05-01), Maruyama
patent: 5343074 (1994-08-01), Higgins et al.
Abstract of Publication No. JP63-255953, Patent Abstracts of Japan, vol. 13, No. 74 (1989).
Abstract of Publication No. JP1-145842, Patent Abstracts of Japan, vol. 13, No. 404 (1989).
Abstract of Publication No. JP2-31454, Patent Abstracts of Japan, vol. 14, No. 178 (1990).
Abstract of Publication No. JP3-244149, Patent Abstracts of Japan, vol. 16, No. 31 (1992).
Abstract of Publication No. JP5-47819, Patent Abstracts of Japan, vol. 17, No. 344 (1993).
Abstract of Publication No. JP5-160333, Patent Abstracts of Japan, vol. 17, No. 556 (1993).

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