4. Package making
  5. Methods
  6. Forming or partial forming a receptacle and subsequent filling

Toshimitsu Ishikawa

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Apparatus for manufacturing a semiconductor device

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Patent

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Apparatus for manufacturing gelatin capsule and method therefor

Package making – Methods – Forming or partial forming a receptacle and subsequent filling
Patent

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Fuel assembly

Induced nuclear reactions: processes – systems – and elements – Fuel component structure – Plural fuel segments or elements
Patent

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Gelatin capsule manufacturing apparatus

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Reexamination Certificate

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Method of manufacturing gelatin capsule containing powder or...

Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – Starting material is nonhollow planar finite length preform...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-323706

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