4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Mitsuhiro Nakao

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Apparatus and method for manufacturing semiconductor device

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Reexamination Certificate

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Manufacturing method for solid state image pickup device

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
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Noise suppressing damper

Ventilation – Having inlet airway – Including structure for mixing plural air streams together
Reexamination Certificate

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Semiconductor device wherein chips are stacked to have a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Semiconductor device with improved bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-469826

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