Stabilized power supply device using a flip chip as an active co

Details Stabilized power supply device using a flip chip as an active co Stabilized power supply device using a flip chip as an active co

1995-05-11

1997-02-18

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257691, 257737, 257738, 257904, 361702, 361729, 363147, H01L 2348, H01L 2940, H01L 2328, H05K 720

Patent

active

056043830

ABSTRACT:
A stabilized power supply device includes a substrate and a passive part laminate layered on the substrate. The passive part laminate, shaped as a single flat board, includes a thin charge storage film element. A thin magnetic inductive film element is laminated on the thin charge storage film element. The device also includes an active part incorporated in a flip chip. The flip chip, including semiconductors and bump electrodes, is mounted on an upper surface of the passive part laminate. The upper surface of the passive part laminate includes terminals for connecting the passive part laminate to the bump electrodes. This connection also fixes the active part to the passive part laminate.

REFERENCES:
patent: 5355301 (1994-10-01), Satio et al.

Affiliated with

Also associated with

Rating

Stabilized power supply device using a flip chip as an active co does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stabilized power supply device using a flip chip as an active co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stabilized power supply device using a flip chip as an active co will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1603874