Apparatus for mounting a flip-chip semiconductor device

Details Apparatus for mounting a flip-chip semiconductor device Apparatus for mounting a flip-chip semiconductor device

1995-12-05

1998-04-28

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257664, 257698, 257728, 257774, H01L 2348, H01L 2352

Patent

active

057448698

ABSTRACT:
A laser-tunable semiconductor device assembly (LSDA) is provided for electrical connection between multiple semiconductor devices (101, 103) within a RF transistor (100). The LSDA (100) provides for flip-chip type electrical connection between semiconductor devices (101, 103) utilizing solder bumps (503) existing on the semiconductor devices (101, 103) or the LSDA (100). A metalization pattern exists on both sides of the LSDA (100), electrically connected through via holes (403) existing in the LSDA (100). Laser tuning metallic pads (405) are provided for performance matching of the transistor. The use of the LSDA (100) provides for accurate modeling of the electrical connection between semiconductor devices (101, 103), while allowing for "on-line" process control of electrical performance of the transistor and acceptable heat dissipation through the bottom of the semiconductor devices (101, 103).

REFERENCES:
patent: 5115300 (1992-05-01), Yanagida et al.
patent: 5166772 (1992-11-01), Soldner et al.
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5334804 (1994-08-01), Love et al.
patent: 5341979 (1994-08-01), Gupta
patent: 5347160 (1994-09-01), Sutrina
patent: 5406122 (1995-04-01), Wong et al.
patent: 5410181 (1995-04-01), Zollo et al.
patent: 5435733 (1995-07-01), Chernicky et al.
patent: 5606196 (1997-02-01), Lee et al.

Affiliated with

Also associated with

Rating

Apparatus for mounting a flip-chip semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for mounting a flip-chip semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for mounting a flip-chip semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1535019